Author name: Iqra Rehman

2D X-Ray vs. Micro-CT
Blog

Micro-CT for BGA and Solder Joint Voids

A Ball Grid Array package hides its solder connections underneath the die itself. There is no angle from which a camera, or even a standard 2D X-ray, can view a BGA joint without every other joint in the array overlapping it in the same projection.

Scroll to Top