Author name: Iqra Rehman

2D X-Ray vs. Micro-CT
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Micro-CT for BGA and Solder Joint Voids

A Ball Grid Array package hides its solder connections underneath the die itself. There is no angle from which a camera, or even a standard 2D X-ray, can view a BGA joint without every other joint in the array overlapping it in the same projection.

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Detecting Powder Contamination in 3D-Printed Titanium

Titanium powder used in additive manufacturing is reused across multiple build cycles. Each reuse cycle is also an opportunity for contamination to enter the powder bed, and once contamination is embedded inside a printed part, it cannot be removed. It can only be found.

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