XRAY-LAB | Industrial X-ray analysis & 3D computed tomography (CT)

Zerstörungsfreie Prüfung (ZfP), industrielle Röntgentechnik und -analyse in 2D & 2,5D, Computertomographie (CT), Röntgenanlagen im Sondermaschinenbau, 3D Objekterfassung und 3D Messtechnik

XVOIDPRO Software FOR THE X-RAY ANALYSIS FROM HAIRPINS

307 275 XRAY-LAB | Industrial X-ray analysis & 3D computed tomography (CT)

XVOIDPRO for the analysis of hairpins. Using X-RAY and software XVOIDPRO

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XVOIDPRO

BGA and Solder Joint Analysis

1024 536 XRAY-LAB | Industrial X-ray analysis & 3D computed tomography (CT)

XVOIDPRO automatic AI based analysis software for electronic components with integrated report generator The latest version of XVOIDPRO for the solder joint analysis of electronic components now also enables the automatic detection of solder joints and BGA balls and their evaluation. This makes the semi-automatic or fully automatic evaluation of assembled circuit boards much more efficient.The analysis software XVOIDPRO uses…

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Xray Software for Visualisation

Solder joint analysis using Artificial Intelligence

1024 555 XRAY-LAB | Industrial X-ray analysis & 3D computed tomography (CT)

Lötstellenanalyse mittels künstlicher Intelligenz

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Xray Software for Visualisation

XViewer Pro – Visualize analysis results

1024 555 XRAY-LAB | Industrial X-ray analysis & 3D computed tomography (CT)

XViewer Pro – Visualise analysis results interactively.Xviewer Pro offers the possibility to visualize analysis results generated by XPaint Pro and XVoid Pro. Directly export analysis results directly as Excel Reports. XViewer Pro is now available on the Software download page for everyone! New challenges for today’s industry Buzzwords such as AI, Big Data, Industry 4.0 and digital twin require a…

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X-ray inspection of BGA with the XVOIDPRO software

1024 717 XRAY-LAB | Industrial X-ray analysis & 3D computed tomography (CT)

X-RAY BGA inspection Automatic evaluation of Ball Grid Array (BGA). The balls can be recognized and scored. AI instructions are used for the objects of the components. An electrical test does not provide any information about the state of the solder joint. Y-Ray technology must be taken over for the control of form and containment.The IPC-A-610 is based on the…

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