Automatic evaluation of Ball Grid Array (BGA).
The balls can be recognized and scored. AI instructions are used for the objects of the components. An electrical test does not provide any information about the state of the solder joint. Y-Ray technology must be taken over for the control of form and containment.
The IPC-A-610 is based on the BGA components such as solder ball offset, solder ball spacing, solder ball shape and entries in the soldering.
The sum of the void areas in relation to the ball area gives the percentage of pores. The detection of the ball area and void areas is calculated automatically with XVOIDPRO. There will be a report per ball with all inclusions, the sum of the inclusions in the center of the ball surface and a shape deviation.