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BGA and Solder Joint Analysis

1024 536 XRAY-LAB | Industrial X-ray analysis & 3D computed tomography (CT)

XVOIDPRO automatic AI based analysis software for electronic components with integrated report generator The latest version of XVOIDPRO for the solder joint analysis of electronic components now also enables the automatic detection of solder joints and BGA balls and their evaluation. This makes the semi-automatic or fully automatic evaluation of assembled circuit boards much more efficient.The analysis software XVOIDPRO uses…

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