BGA and Solder Joint Analysis

1024 536 XRAY-LAB | Industrial X-ray analysis & 3D computed tomography (CT)

XVOIDPRO automatic AI based analysis software for electronic components with integrated report generator

The latest version of XVOIDPRO for the solder joint analysis of electronic components now also enables the automatic detection of solder joints and BGA balls and their evaluation. This makes the semi-automatic or fully automatic evaluation of assembled circuit boards much more efficient.
The analysis software XVOIDPRO uses AI (artificial intelligence) for the solder joint analysis and the determination of the solder joints and balls.
The great advantage of artificial intelligence is that the software recognizes further characteristics by training data sets.